Leica DCM 3D Measuring Microscope
Dual core combines interferometry and confocal imaging
The dual-core DCM 3D measuring microscope presents a complete solution, combining the advantages of confocal and interferometry technologies. With compact and robust design, this instrument provides super-fast, non-destructive assessment of the micro- and nano-geometries of critical industrial component surfaces. From R&D and quality inspection laboratories to robotic-driven systems in online process control, the innovative Leica DCM 3D can serve a wide range of applications where high speed measurements with resolution down to 0.1 nm are needed.
This instrument's micro optical measurement technology fulfils two important requirements of metrology: non-destructive measurement combined with high accuracy. The measuring capabilities of the Leica DCM 3D range from a few nanometers to several millimeters, to serve a wide variety of applications. In addition, it carries out measurements at extremely high speed.
Now, with a single system it is possible to analyze rough (confocal) as well as smooth (Vertical Scanning Interferometry or VSI) and super smooth (Phase Shift Interferometry or PSI) surfaces. Sub-micron lateral resolution and a vertical resolution in the nm range is obtained in confocal mode, while large fields of view in combination with sub-nanometer Z resolution are acquired in the Interferometry mode.
The camera captures 3Mpixel color images directly onto an SD card or to a connected PC. The camera comes with intuitive LAS EZ software including basic measurement, annotation and archiving. All image and calibration data can be stored with the image for later reference.
- Confocal and Interferometry — dual core technology for high-speed measurements and high-resolution, from 0.1 nm to 10 mm.
- Interferometry PSI and VSI — provides the highest precision measurement of surfaces, with sub-nanometer resolution.
- Micro display confocal technology — confocal and bright-field imaging of the same area simultaneously.
- Fast, non-destructive 3D measurements — no sample preparation necessary (unlike what is needed for Scanning Electron Microscopy).